Postdoctoral Associate (Device Fabrication)
IRG_WISDOM_2025_004
Project Overview
Wafer-Scale Integrated Sensing Devices based on Optoelectronic Metasurfaces (WISDOM) focuses on semiconductor wafer growth and processing for photonic applications.
This program aims to pioneer a wafer-scale integrated platform which seamlessly combines metasurface optics, optoelectronic devices with a focus on light emitting diodes (LEDs) and vertical surface emitting laser arrays (VCSELs), and silicon complementary metal-oxide semiconductor (CMOS) electronics.
Researchers from MIT, NUS, NTU, A*STAR, Stanford University and University of Illinois form a uniquely qualified interdisciplinary team possessing the skills and infrastructure needed to perform the proposed research. WISDOM program will also involve a strong network of industry partners which are committed to development and translation of the WISDOM technology, thereby enabling outcomes from the program to make a direct impact on industrial applications.
Responsibilities
The WISDOM IRG at SMART is seeking a qualified candidate for a Postdoctoral Associate position jointly supervised by Prof. Steven Johnson (MIT) and Prof. Cheng-Wei Qiu (NUS). This position will entail the following technical responsibilities:
1. Perform optical modelling and typically machine learning for metasurface design.
2. Perform inverse design of topological photonic crystals
3. Carry out characterization of metasurface devices, including (but not limited to): optical and electron microscopy, building optical setups, EBL/FIB, etc
4. Coordinate with other teams of this project on device fabrication and integration.
5. Perform other duties as assigned.
Requirements
1. Ph.D. Degree in Electronic/Electrical Engineering, Physics, or other related discipline.
2. Prior experience in optical metasurface design, fabrication, and testing is preferred.
3. Prior experience in photonic/semiconductor foundry tape-out is preferred.
4. The candidate needs to work well in a team, and with other lab/cleanroom users.
Interested applicants are invited to send in their full CV/resume, cover letter and list of three references (to include reference names and contact information). We regret that only shortlisted candidates will be notified.